ramin farjadrad

The company's strategic investor roster — all three memory suppliers (Samsung, SK Hynix, Micron), all three leading foundries, two switch vendors, multiple hyperscalers, and three of the largest CPU/GPU makers — signals broad ecosystem validation for its optical interconnect technology as the key enabler for custom AI accelerator development.

Eliyan co-founder asserts they are years ahead of Broadcom in die-to-die interconnect (fastest at lowest power) and have optical rack-to-rack solutions replacing copper, positioning to win hyperscaler custom silicon designs.

Eliyan's die-to-die, chip-to-chip, and rack-to-rack interconnect solves the connectivity bottleneck for next-gen AI systems, with fastest high-speed die-to-die at lowest power and optical solutions replacing copper for longer reach across AI racks.

Eliyan competes directly with Broadcom in AI connectivity but asserts a multi-year lead in high-speed die-to-die and optical rack-to-rack solutions that match copper's reliability and power at longer reach, targeting the hyperscaler custom-silicon ecosystem Broadcom also serves.

AI has shifted from a chip problem to a system problem where connectivity is the bottleneck; Eliyan's die-to-die, chip-to-chip, and rack-to-rack optical interconnect technology is years ahead of incumbents, backed by strategic investors including all three memory suppliers, three fabs, two switch makers, and three largest chip makers.

Eliyan competing directly with Broadcom on connectivity solutions; claims fastest high-span die-to-die at lowest power and optical rack-to-rack solution matching copper reliability with longer reach, positioning ahead of incumbent for next-gen AI pod scaling.

Connectivity is the new bottleneck for AI systems as chiplet architectures scale; Eliyan's die-to-die, chip-to-chip, and rack-to-rack optical interconnect enables hyperscalers to build custom silicon competitive with Nvidia, backed by strategic investors including all three memory suppliers, fabs, and major chip makers.