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▶ 3:48 · $NVDA · Cerebras CEO on the Future of Data Centres, Token Costs & Memory | Should US Companies Sell to China
episode briefing
20VC

Cerebras CEO on the Future of Data Centres, Token Costs & Memory | Should US Companies Sell to China

2026-05-26 · 9 company · 9 thematic
sentiment
6 bull0 bear3 neu
speakers
andrew feldman

Leads Cerebras, a public company (CBRS) building wafer-scale AI inference chips; previously co-founded SeaMicro (acquired by AMD); describes $25B backlog and global data center buildout at unprecedented scale.

quote
“Nvidia has a backlog. Uh AMD has a backlog. Others have backlogs. Um they have backlogs because we can't get data centers built fast enough. ... neo clouds are buying hardware with gross margins of 70, 80% for Nvidia. So, the hardware in t…”
—andrew feldman

episode shorts · 3

Cerebras CEO WARNS About Selling AI Chips to China

HR Is About to Be Automated

AI Didn’t Cause These Layoffs

now playing · $NVDA
$NVDA···neutral· highandrew feldman
Nvidia's GPU dominance creates HBM/CoWoS bottlenecks; neo clouds buy at 70-80% gross margins
Nvidia GPUs depend on HBM (only 3 suppliers) and CoWoS packaging at TSMC, creating structural supply constraints. Nvidia funds neo clouds (CoreWeave etc.) to compete with hypersca…
$OPENAIbullish· high· posandrew feldman
OpenAI's early compute foresight (Sam Altman) was a superpower; now a $20B+ Cerebras customer
Sam Altman believed exponential compute demand years ahead of others and contracted for power, data centers, and hardware early. This foresight is a superpower in exponential grow…
$MU···bullish· highandrew feldman
Micron earning 80-85% gross margins on HBM — software margins on memory
HBM is the #2 bottleneck after TSMC fab space. Only three companies (Samsung, Micron, Hynix) make HBM. They cannot add capacity quickly (fabs take 5 years, $40B). Micron is printi…
$CBRS···bullish· high· posandrew feldman
Cerebras CEO: Wafer-scale architecture avoids HBM/CoWoS bottlenecks, 15x faster inference
Cerebras uses on-chip SRAM instead of HBM, avoiding the severe memory shortage and CoWoS packaging constraints that limit GPU suppliers. At 5nm (vs oversubscribed 3nm), their supp…
$TSM···bullish· highandrew feldman
TSMC 3nm oversubscribed, 5nm advantage; CoWoS packaging a key bottleneck
TSMC's 3nm node is the most oversubscribed; Cerebras at 5nm has supply advantage. CoWoS advanced packaging is a critical constraint for GPU makers. Onshoring leading-edge fabs and…
$GOOGL···neutral· mediumandrew feldman
Google's full-stack TPU ownership may yield lowest token cost, but single-customer model limits scale
Google owns the full stack from TPUs to data centers, networking, power — potentially making them the lowest-cost token producer. However, historically selling chips only to yours…
$CRWV···bullish· mediumandrew feldman
CoreWeave praised for innovative financial engineering and rapid deployment
CoreWeave solved financial challenges with innovative structures (first to use GPU-backed financing) and excels at rapid deployment — a critical skill in the current supply-constr…
$KIMMY-K2bullish· mediumandrew feldman
Chinese open-source models (Kimmy K2, DeepSeek, Qwen, GLM) exceptionally good, near frontier
Chinese open-source models are exceptionally good — not quite at closed-source frontier but close. Cerebras demonstrated 6.7x faster inference on Kimmy K2 vs next fastest GPU clou…
$ASML···neutral· highandrew feldman
ASML/TSMC choke points enable US to keep China down-rev on leading-edge chips
The semiconductor supply chain has natural choke points: TSMC for fab, ASML for EUV lithography. These allow the US to restrict China's access to cutting-edge technology without n…